MMD’s g-line photolithography toolset is specifically tailored for MEMS production. Our fully automated line is capable of handling opaque, transparent, and semi-transparent substrates; as well as multiple photoresist processes. A robust, dual-layer resist is used for lift-off processing. Contact, proximity and stepper alignment & exposure is capable of resolving features as small as 0.7 µm. IR backside alignment is used for double-sided photolithography.