A Pure-play Foundry for
MEMS and Thin-film Devices
Midwest MicroDevices Class 10 Cleanroom

Sputtering and Evaporation

MMD’s metal and semi-metal deposition capabilities are world-class. Our automated, HMI-controlled, batch sputtering and evaporation systems are able to deposit a wide range of materials. Sputtering capabilities include DC-magnetron sputtering, reactive sputtering, and co-sputtering from 2 target materials. RF bias during deposition, RF back-sputtering, load-lock heating, and heating during deposition are all available options. Evaporation capabilities include metals and semi-metals. Long-throw distance evaporation is used to ensure uniformity and repeatability in deposited films. Lift-off and planetary fixturing and heating before and during deposition are available. Our custom, dual-source e-beam evaporation system is capable of depositing homogeneous alloys to within ±2%.

Sputtering

  • Aluminum
  • Aluminum-Silicon
  • Titanium
  • Titanium Nitride
  • Tungsten
  • Titanium-Tungsten
  • Gold
  • Platinum
  • Nickel
  • Copper
  • Molybdenum
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Evaporation

Metals

  • Aluminum
  • Titanium
  • Chromium
  • Nickel
  • Gold
  • Platinum
  • Silver
  • Copper
  • Silicon
  • Germanium
  • Antimony
  • Bismuth

Alloys

  • Aluminum-Silicon
  • Ni-chrome
  • Gold-Germanium
  • Bismuth-Antimony
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