MMD’s metal and semi-metal deposition capabilities are world-class. Our automated, HMI-controlled, batch sputtering and evaporation systems are able to deposit a wide range of materials. Sputtering capabilities include DC-magnetron sputtering, reactive sputtering, and co-sputtering from 2 target materials. RF bias during deposition, RF back-sputtering, load-lock heating, and heating during deposition are all available options. Evaporation capabilities include metals and semi-metals. Long-throw distance evaporation is used to ensure uniformity and repeatability in deposited films. Lift-off and planetary fixturing and heating before and during deposition are available. Our custom, dual-source e-beam evaporation system is capable of depositing homogeneous alloys to within ±2%.