A Pure-play Foundry for
MEMS and Thin-film Devices
Midwest MicroDevices Class 10 Cleanroom


Reactive-ion etching, plasma etching, and wet chemical etching are all processes that MMD utilizes in the fabrication of MEMS devices. RIE processes are performed in a multi-chamber cluster tool with fully automated robotic handling, upgraded with the capability to handle transparent and semi-transparent substrates. Plasma etching is available for photoresist removal, isotropic dielectric etching, and organic polymer etching. Wet chemical etching of a variety of materials is performed with pre-mixed, stabilized etchants for excellent repeatability and etch control.

Reactive Ion Etching

  • Silicon dioxide
  • Silicon nitride
  • Polysilicon, anisotropic
  • Polysilicon, isotropic
  • Silicon, isotropic
  • Silicon, anisotropic
  • Aluminum
  • Titanium
  • Hafnium oxide
  • PZT

Plasma Etching

  • Photoresist removal
  • Polymer removal
  • Silicon dioxide, isotropic
  • BPSG via etch
  • Parylene via etch

Wet Etching

  • Silicon
  • Polysilicon
  • Silicon dioxide
  • Silicon nitride
  • Aluminum
  • Aluminum/Silicon
  • Titanium
  • Titanium Nitride
  • Chromium
  • Gold
  • Tungsten
  • Titanium/Tungsten
  • ITO

Wet Processing

  • Acid cleaning
  • Solvent cleaning
  • Metal lift-off